TheknolojiPli-arameter:
Lebelo le Leholo la Tshebetso | 300mm/s(X1);100mm/s(X2);50mm/s(Y);50mm/s(Z);600rpm(θ) | |||
Boemo bo Nepahetseng | ± 3um (X1) ± 5um (X2); ± 3um (Y); ± 3um (Z) ± 15arcsec (θ) | |||
Ho Feta Position Ho Nepaha | ±1um(X1);±3um(X2);±1um(Y);±1um(Z);±3arcsec(θ) | |||
Ho Seha Bophara ba Seam | 20um ~ 30um | |||
Lisebelisoa tsa mochini | 304&316L&Ni-Ti&L605&Al&Gu&Li&Mg&Fe joalo-joalo. | |||
Bolelele bo se nang letho ba tube | <2.5m (ts'ehetso ea tšehetso e ka etsoa ka mokhoa o ikhethileng); | |||
Ho sebetsa lerako botenya | 0 ~ 1.5±0.02 limilimithara; | |||
Sebaka sa ts'ebetso ea liphaephe | Φ0.3~Φ7.5&Φ1.0~Φ16.0±0.02 limilimithara; | |||
Lethathamo la tšebetso ea sefofane | 200mm (300mm) * 100mm; | |||
mefuta ea ho sebetsa | 0~300mm&0~600mm (lihlahisoa tse telele li ka sebetsoa ka likarolo tse arohaneng mokhoa); | |||
Bolelele ba thepa e setseng | 60 limilimithara | |||
Mofuta oa laser | Fiber laser; | |||
Laser wavelength | 1030-1070±10nm; | |||
matla a laser | 200W&250W&300W&500W&1000W&QCW150W bakeng sa khetho; | |||
Phepelo ea motlakase ea lisebelisoa | 220V± 10%, 50Hz;AC 25A (sekhechana se seholo sa potoloho); | |||
Sebopeho sa faele | DXF&DWG&STP&IGS; | |||
Litekanyo tsa lisebelisoa | 1200mm(&1800mm)x1300mmx1750mm; | |||
Boima ba lisebelisoa | 1500Kg. |
Ho ikamahanya le maemo ho matla
① Ka ho itšeha ka laser, ho itšeha le ho phunya le ho phunya le ho betla le tse ling tse ntle tsa machining
②Can mochini 304&316L&Ni-Ti&L605&Li&Mg&Al&Cu&Fe&Ceramic le lisebelisoa tse ling
③Na mochini oa sefofane le lisebelisoa tse kobehileng holim'a metsi
④Fana ka maemo a habeli & pono ea mochini & ho amohela le ho koala sekheo le ho kenya le ho laolla sistimi & ho beha leihlo ka matla le mesebetsi e meng e ts'oanang.
⑤ E na le hlooho e iketselitseng nako e telele le e khuts'oane ea laser e sehang hlooho e bohale le molomo o bataletseng & e tsamaisana le hlooho e fumanehang khoebong ea laser.
⑥E na le sistimi e iketselitseng ea 2D & 2.5D & 3D CAM ea laser micromachining
Latela mohopolo oa moralo oa ergonomics, o bobebe ebile o khuts'oane
Sebaka sa kopo:
Laser micromachining ea lisebelisoa tsa ho buoa le tsa masapo tse kang endoscope e thata & ultrasonic scalpel & endoscope& stapler & suture device & soft drill & planer & puncture nale & nose drill
Mochine o nepahetseng haholo:
①Bophara bo bonyenyane ba seam: 18 ~ 30um
②Ho nepahala ha mochini o phahameng: ≤ ± 10um
③Boleng bo botle ba ho seha: ha ho burr le ho seha ho boreleli
④Bokhoni bo phahameng ba mochini: ho seha hanngoe ka lebota le lehlakoreng le le leng le mochini o tsoelang pele oa phepelo
Moqapi o feto-fetohang
① Latela mohopolo oa moralo oa ergonomics, o bobebe ebile o khuts'oane
②Fana ka ts'ebetso ea boikhethelo ea sistimi ea pono ea mochini ho lekola ts'ebetso ea machining ea laser ka nako ea nnete.
③ Ts'ebetso ea software le ea Hardware e tsamaellana habonolo, e ts'ehetsa tlhophiso ea ts'ebetso ea motho ka mong le taolo e bohlale ea tlhahiso.
④Tsehetsa moralo o mocha ho tloha boemong ba karolo ho isa boemong ba sistimi
⑤ Taolo ea mofuta o bulehileng le sistimi ea laser micromachining e bonolo ho sebetsa le sebopeho se hlakileng