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Precision laser

EPLC6080 Precision Optical Fiber Laser Cutting Machine bakeng sa substrate ea PCB e Featured Image
  • EPLC6080 Precision Optical Fiber Laser Cutting Machine bakeng sa substrate ea PCB

EPLC6080 Precision Optical Fiber Laser Cutting Machine bakeng sa substrate ea PCB

Tlhaloso e Khutšoanyane:

Mochini oa ho itšeha oa PCB substrate precision fiber laser e sebelisoa haholo-holo bakeng sa laser microprocessing joalo ka ho itšeha, ho cheka, ho slotting, ho tšoaea le likarolo tse ling tsa aluminium tsa PCB, li-substrates tsa koporo le likaroloana tsa ceramic.


  • Bophara ba seam e nyane:20 ~ 40um
  • Ho nepahala ha mochini o phahameng:≤± 10um
  • Boleng bo botle ba ho seha:boreleli, sebaka se senyehileng se amehileng ke mocheso, li-burr tse nyane le ho phunyeha ha bohale
  • Ntlafatso ea boholo:bonyane ba boholo ba sehlahisoa ke 20um

    • Lintlha tsa Sehlahisoa

    PCB Substrate Precision Fiber Laser Cutting Machine

    PCB substrate precision faeba ka laser ho itšeha mochini haholo-holo e sebelisoa bakeng sa laser microprocessing tse kang laser ho itšeha, cheka le scribing tse sa tšoaneng PCB substrates, e ka bitsoa PCB laser ho itšeha mochine ka nako e khutšoanyane.Joalo ka ho itšeha le ho etsa PCB aluminium substrate, ho seha le ho etsa koporo ea substrate, ho seha le ho etsa ceramic substrate, ho etsa laser substrate ea koporo, ho seha le ho theha, joalo-joalo.

    Litekanyetso tsa Tekheniki:

    Lebelo le phahameng la ts'ebetso 1000mm/s(X) ;1000mm/s(Yl&Y2) ;50mm/s(Z);
    Ho beha ho nepahala ±3um (X) ±3um (Y1&Y2) ±5um (Z);
    Ho nepahala ha maemo a pheta-phetoang ± lum (X) ; ± lum(Y1&Y2) ;±3um(Z);
    Lisebelisoa tsa mochini ho nepahala tšepe e sa hloekang, tšepe ea alloy e thata le lisebelisoa tse ling pele kapa ka mor'a kalafo ea holim'a metsi
    Botenya ba lerako la thepa 0 ~ 2.0±0.02mm;
    Lethathamo la mechine ea lifofane 600mm * 800mm; (tšehetso bakeng sa litlhoko tse kholo tsa sebopeho)
    Mofuta oa laser Fiber laser;
    Laser wavelength 1030-1070±10nm;
    matla a laser CW1000W&CW2000W&QCW150W&QCW450W&QCW750W bakeng sa khetho;
    Phepelo ea motlakase ea lisebelisoa 220V± 10%, 50Hz;AC 30A (sekhechana se seholo sa potoloho);
    Sebopeho sa faele DXF, DWG;
    Litekanyo tsa lisebelisoa 1750mm * 1850mm * 1600mm;
    Boima ba lisebelisoa 1800Kg.

    Mohlala oa Pontšo:

    setšoantšo7

    Sebaka sa kopo
    Laser micromachining ea sefofane le lisebelisoa tse ka holimo tse kobehileng tsa tšepe e sa hloekang e nepahetseng le alloy e thata pele kapa ka mor'a kalafo ea holim'a metsi.

    Ho sebetsa ka nepo ka holimo
    Le bophara ba seam se senyenyane: 20 ~ 40um
    Ho nepahala ha mochini o phahameng: ≤ ± 10um
    Boleng bo botle ba ho seha: ho seha ho boreleli le sebaka se senyenyane se amehileng ke mocheso le li-burr tse nyane
    Tokiso ea boholo: bonyane boholo ba sehlahisoa ke 100um

    Ho ikamahanya le maemo ho matla
    E na le bokhoni ba ho itšeha ka laser, ho cheka, ho tšoaea le ho etsa machining a mang a matle a substrate ea PCB
    Na o ka mochini oa substrate ea aluminium ea PCB, substrate ea koporo, substrate ea ceramic le lisebelisoa tse ling
    E na le sethala se iketselitseng sa dual-drive precision motion platform, sethala sa granite le tlhophiso ea shafting e tiisitsoeng.
    E fana ka maemo a mabeli le boemo ba pono & ho jarolla le ho laolla sistimi le mesebetsi e meng eo u ka e khethang
    E na le nozzle e telele le e khuts'oane e nchocho le hlooho e sephara ea laser e nang le "vacuum adsorption clamping fixture" le mojule oa pokello ea lerōle la slag le sistimi ea lipeipi tsa ho tlosa lerole le sistimi ea kalafo e thibelang ho phatloha.
    E na le sistimi e ikemetseng ea 2D & 2.5D & CAM bakeng sa laser micromachining.

    Moqapi o feto-fetohang
    Latela mohopolo oa moralo oa ergonomics, o bobebe ebile o khuts'oane
    ^Karohano ea tšebetso ea software e bonolo le ea hardware, e ts'ehetsang tlhophiso ea ts'ebetso ea motho ka mong le taolo e bohlale ea tlhahiso
    E ts'ehetsa moralo o motle oa boqapi ho tloha boemong ba likarolo ho isa boemong ba sistimi
    # Open Control & laser micromachining software e bonolo ho e sebelisa le sebopeho se hlakileng

    Setifikeiti sa tekheniki
    ka CE
    ISO9001
    Setšoantšo sa IATF16949

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