Ka nts'etsopele e potlakileng ea indasteri ea lisebelisoa tsa elektroniki tsa bareki lefatšeng ka bophara, lihlahisoa tsa lisebelisoa tsa elektronike li ntse li tsoela pele ho ea ho kopanyo e phahameng le ho nepahala ho phahameng.Likarolo tse ka hare tsa lihlahisoa tsa elektroniki li ntse li fokotseha, 'me litlhoko tsa ho nepahala le ho kopanya ha elektronike li ntse li phahama le ho feta.Nts'etsopele ea theknoloji e tsoetseng pele ea tlhahiso ea laser e tlisitse tharollo ea litlhoko tsa ts'ebetso e nepahetseng ea indasteri ea elektroniki.Ho nka mohlala oa mokhoa oa tlhahiso ea liselefouno, theknoloji ea laser processing e kenelletse ka har'a ho seha skrineng, ho seha lense ea k'hamera, ho tšoaea li-logo, ho cheselletsa likarolo tse ka hare le lits'ebetso tse ling.Sebokeng sa "2019 Seminar mabapi le ts'ebeliso ea theknoloji e tsoetseng pele ea tlhahiso ea laser indastering", litsebi tsa mahlale le tsa tekheniki tse tsoang Univesithing ea Tsinghua le Setsi sa Shanghai sa Optics le mechanics ea China Academy of Sciences li ile tsa etsa lipuisano tse tebileng mabapi le ts'ebeliso ea hajoale ea tlhahiso e tsoetseng pele ea laser ts'ebetsong e nepahetseng ea lihlahisoa tsa elektroniki tsa bareki.
Joale e re ke u ise ho sekaseka lits'ebetso tse ts'eletseng tsa laser ea ultrafast ts'ebetsong e nepahetseng ea indasteri ea lisebelisoa tsa elektroniki:
1.Ultra fast laser ultra-fine special production: Ultra fast laser micro nano processing ke ultra-fine special production technology, e ka sebetsanang le thepa e khethehileng ho finyella mehaho e khethehileng le thepa e khethehileng ea optical, motlakase, mechine le tse ling.Le hoja theknoloji ena e ke ke ea hlola e itšetleha ka thepa ea ho etsa lithulusi, e atolosa mefuta ea lisebelisoa tse entsoeng, 'me e na le melemo ea ho se sebetse le ho senyeha.Ka nako e ts'oanang, ho boetse ho na le mathata a lokelang ho rarolloa le ho ntlafatsoa, a kang ho fana ka matla le ts'ebeliso ea ts'ebeliso ea matla, matla a laser le khetho ea leqhubu la absorption, ho nepahala ha sebaka sa ho fana, ho etsa mohlala oa lisebelisoa, ho sebetsa hantle le ho nepahala."Moprofesa sunhongbo oa Univesithi ea Tsinghua o lumela hore tlhahiso ea laser e ntse e laoloa ke lisebelisoa tse khethehileng, 'me tlhahiso ea macro le micro nano e etsa mesebetsi ea bona e fapaneng. lisebelisoa tsa optical le template transfer, quantum chips le nano robots. Tataiso ea tsoelo-pele ea nakong e tlang ea tlhahiso ea laser ea ultrafast e tla ba theknoloji e phahameng, lihlahisoa tse phahameng tse eketsehileng, 'me li loanele ho fumana katleho indastering. "
2.Hundred watt ultrafast fiber lasers le likopo tsa bona: lilemong tsa morao tjena, li-laser tsa ultrafast fiber li 'nile tsa sebelisoa haholo ho lisebelisoa tsa elektronike tsa bareki, matla a macha, li-semiconductors, tsa bongaka le tse ling tse nang le liphello tse ikhethang tsa ts'ebetso.E kenyelletsa ho sebelisoa ha ultrafast fiber laser masimong a micromachining a matle a kang flexible circuit board, OLED display, PCB board, anisotropic cutting of mobile phone screen, joalo-joalo The ultrafast laser market ke e 'ngoe ea limmaraka tse ntseng li hōla ka potlako tšimong e teng ea laser.Ho hakanngoa hore kakaretso ea 'maraka oa laser ea ultrafast e tla feta lidolara tse limilione tse likete tse peli tsa Amerika ka 2020. Hajoale,' maraka o moholo ke li-lasers tsa boemo bo tiileng ba maemo a holimo, empa ka keketseho ea matla a pulse a ultrafast fiber lasers, karolo ea ultrafast fiber lasers tla eketseha haholo.Ho hlaha ha li-laser tse matla tsa ultrafast fiber tse kholo ho feta 150 W ho tla potlakisa katoloso ea 'maraka ea li-lasers tsa ultrafast,' me 1000 W le MJ femtosecond lasers butle-butle li tla kena 'marakeng.
3.Tšebeliso ea laser ea ultrafast ka ho sebetsa ha likhalase: nts'etsopele ea theknoloji ea 5g le kholo e potlakileng ea tlhokahalo ea ho qetela e khothalletsa nts'etsopele ea lisebelisoa tsa semiconductor le theknoloji ea ho paka, le ho beha litlhoko tse phahameng bakeng sa katleho le ho nepahala ha ho sebetsa ha khalase.Theknoloji ea Ultrafast laser processing e ka rarolla mathata a ka holimo 'me ea fetoha khetho ea boleng bo phahameng bakeng sa ts'ebetso ea khalase nakong ea 5g.
4. Kopo ea ho itšeha ka mokhoa o nepahetseng oa laser indastering ea elektronike: fiber laser e phahameng e ka phetha ka lebelo le phahameng le ka mokhoa o phahameng oa ho itšeha ka laser, ho cheka le lisebelisoa tse ling tsa laser micro machining ho ea ka litšoantšo tsa moralo oa ho nepahala ha tšepe e entsoeng ka tšepe e lekanang le phala e lekanang le bophara. phala e khethehileng e nang le sebōpeho, hammoho le ho itšeha ho nepahetseng ha sefofane sa sebopeho se senyenyane.Ea morao-rao ke lisebelisoa tsa laser micromachining tse lebelo le phahameng le tse phahameng tse khethehileng ka sefofane se nepahetseng sa lisebelisoa tse nang le marako a tšesaane, tse khonang ho sebetsa tšepe e sa hloekang, alloy ea aluminium, alloy ea koporo, tungsten, molybdenum, lithium, magnesium aluminium alloy, ceramics le lisebelisoa tse ling tsa sefofane. e sebelisoang hangata tšimong ea lisebelisoa tsa elektroniki.
5.Kopo ea laser ea ultrafast ha ho etsoa skrine e nang le sebōpeho se khethehileng: iphonex e butse mokhoa o mocha oa skrine e pharaletseng e nang le sebōpeho se khethehileng, hape e khothalelitse tsoelo-pele e tsoelang pele le nts'etsopele ea theknoloji e khethehileng ea ho itšeha skrineng.Zhu Jian, mookameli oa lefapha la khoebo la Han la laser vision le semiconductor, o hlahisitse theknoloji ea Han e ikemetseng ea li-icicles diffraction free beam technology.Theknoloji e nka mokhoa oa pele oa optical, o ka etsang hore matla a aroloe ka mokhoa o ts'oanang le ho netefatsa boleng bo tsitsitseng ba karolo ea ho itšeha;Amohela leano la ho arola ka boiketsetso;Ka mor'a hore skrine ea LCD e khaotsoe, ha ho na karoloana e phatlohang holim'a metsi, 'me ho nepahala ho itšeha ho phahame (<20 μ m) Phello e tlaase ea mocheso (<50 μ m) Le melemo e meng.Theknoloji ena e loketse ho sebetsa ka seipone se senyenyane, ho itšeha likhalase tse tšesaane, ho cheka skrineng sa LCD, ho itšeha likhalase tsa koloi le masimo a mang.
6.Theknoloji le ts'ebeliso ea li-circuits tsa laser printing conductive holim'a lisebelisoa tsa ceramic: lisebelisoa tsa ceramic li na le melemo e mengata, joalo ka mocheso o phahameng oa mocheso, mocheso o tlaase oa dielectric, thepa e matla ea mochine, ts'ebetso e ntle ea ho pata, joalo-joalo.Butle-butle li fetohile sebaka se setle sa ho paka bakeng sa moloko o mocha oa lipotoloho tse kopaneng, li-circuits tsa semiconductor module le li-module tsa elektroniki tsa matla.Theknoloji ea ho paka ka boto ea potoloho ea Ceramic le eona e amehile haholo ebile e ntlafalitsoe ka potlako.Theknoloji e teng ea tlhahiso ea boto ea potoloho ea ceramic e na le mefokolo e itseng, joalo ka lisebelisoa tse theko e boima, potoloho e telele ea tlhahiso, ho se sebetse ho sa lekaneng ha substrate, e fokotsang nts'etsopele ea mahlale a amanang le lisebelisoa.Ka hona, nts'etsopele ea theknoloji ea tlhahiso ea boto ea potoloho ea ceramic le lisebelisoa tse nang le litokelo tse ikemetseng tsa thepa ea mahlale li bohlokoa haholo ho ntlafatsa boemo ba China botekgeniki le tlholisano ea mantlha lefapheng la tlhahiso ea elektroniki.
Nako ea poso: Jul-08-2022