'Maraka oa Wafer Saw o ka Theha Pale e Ncha ea Kholo ea Epic e Sebelisitsoeng, Meyer Burger, Komatsu NTC, joalo-joalo.

'Maraka oa Wafer Saw o ka Theha Pale e Ncha ea Kholo ea Epic e Sebelisitsoeng, Meyer Burger, Komatsu NTC, joalo-joalo.

Patlisiso ea morao-rao mabapi le 'Maraka oa Wafer Dicing Machines e phatlalalitsoeng ke Data Lab Forecast e kenyelletsang likarolo tsa bohlokoa joalo ka mofuta, kopo, thekiso, kholo, lintlha tsa masimo a tlhahiso ea k'hamphani, boholo ba tlhahiso, bokhoni, ketane ea boleng, litlhaloso tsa sehlahisoa, thepa e tala. ho fumana Leano, ho tsepamisa maikutlo, sebopeho sa mokhatlo le mecha ea kabo.
Ho phatloha ha COVID-19 hona joale ho hasana lefatšeng ka bophara, ho siea tsela e bohloko. Tlaleho ena e bua ka phello ea kokoana-hloko ho lik'hamphani tse etellang pele indastering ea Wafer Dicing Machines.
Boithuto bona ke phuputso e nepahetseng e hokahanyang lintlha tsa boleng le bongata ba Mmaraka oa Wafer Saw. Phuputso e fana ka lintlha tsa nalane ho bapisa ho fetoha ha thekiso, lekeno, bophahamo le boleng ho tloha 2017 ho isa 2021 le ponelopele ho 2030.
Hoa hlokahala ho sekaseka tsoelo-pele ea bahlolisani ha u ntse u sebetsa sebakeng se le seng sa komporo, bakeng sa sena, tlaleho e fana ka lintlha tse felletseng mabapi le maano a ho bapatsa a bahlolisani 'marakeng ho kenyeletsoa lilekane, ho fumana thepa, chelete ea khoebo, tšebelisano' moho le ho qalisoa ha lihlahisoa le lipapatso tsa marang-rang.
Tlhahlobo ea Impact ea Mmaraka oa Wafer Cutting Machine ho COVID-19: Libapali tsa Bohlokoa ke Lisebelisoa tse Sebelisitsoeng, Meyer Burger, Komatsu NTC, Takatori Corporation, Fujikoshi, HG Laser, Synova, Gocmen, Insreo, Rofin, Hanjiang Machine, Shuanghui Machine, Heyan Technology, Keyi Laser. .
Kopitsa sampole ea PDF ka lebokoseng la hau la mangolo hona joale: https://www.datalabforecast.com/request-sample/26282-wafer-cutting-machines-market
Amerika Leboea e tla ba le karolo e kholo ka ho fetisisa ea 'maraka oa mochini oa ho qoela ka 2020 ka lebaka la ts'ebetso e ntseng e eketseha ea tšebelisano ke libapali tsa bohlokoa nakong ea kemiso.
⇛ Ho ithuta le ho sekaseka boholo ba mmaraka oa Wafer Dicing Machine ka libaka / linaha tse bohlokoa, mofuta oa sehlahisoa le ts'ebeliso, datha ea nalane ho tloha 2017 ho isa 2021, le selelekela sa 2030.
⇛ Ho utloisisa sebopeho sa 'maraka oa mochini oa "wafer dicing" ka ho tsebahatsa likaroloana tsa ona tse fapaneng.
E tsepamisitse maikutlo ho libapali tsa lefats'e tsa Wafer Dicing Machine, ho hlalosa, ho hlalosa le ho sekaseka boleng, kabelo ea mmaraka, maemo a tlholisano ea mmaraka, tlhahlobo ea SWOT le merero ea nts'etsopele lilemong tse tlang.
⇛ Ho sekaseka mekhoa ea kholo ea motho ka mong, litebello le tlatsetso ea Wafer Saw Machines 'marakeng ka kakaretso.ECLC6045
⇛ Ho arolelana lintlha tse qaqileng mabapi le lintlha tsa bohlokoa (monyetla oa kholo, menyetla, bakhanni, mathata le likotsi tse ikhethileng indastering) tse susumetsang kholo ea mmaraka.
⇛ Ho bolela esale pele boholo ba 'maraka o monyane oa mochini oa ho qoelisa, o koahelang libaka tsa bohlokoa (le linaha tsa bona tsa bohlokoa).
⇛ Sekaseka tsoelo-pele ea tlholisano e kang katoloso, litumellano, ho qalisoa ha lihlahisoa tse ncha le ho rekoa ha 'maraka.
Libapali tse ling li na le tlaleho e babatsehang ea ho hōla ho tloha 2014 ho ea ho 2018, 'me tse ling tsa lik'hamphani tsena li bona keketseho e kholo ea thekiso le lekeno, ha phaello e ngata e imenne habeli ka nako e le 'ngoe,' me ts'ebetso le likhahla tse kholo li atolohile. lilemo li bontša hore bokhoni ba k'hamphani ea ho reka lihlahisoa tsa eona bo matla ho feta kholo ea litšenyehelo tsa thekiso.
Tlaleho e tsoela pele ho sekaseka lintlha tse nang le motheo oa tlhahiso ea k'hamphani, bophahamo ba tlhahiso, boholo, ketane ea boleng le litlhaloso tsa sehlahisoa.
Ho ea ka DLF, thekiso ka likarolo tsa bohlokoa e tla feta 'maraka oa lidolara ka 2021. Ho fapana le karolo ka mofuta (fiber laser cutter, semiconductor laser cutter, YAG laser cutter), ka ho qetela mosebedisi / kopo (solar, electronics, ba bang.).
Phetolelo ea tlaleho ea 2022 ke ea morao-rao, e tsoela pele ho senya le ho totobatsa liphetoho tse ncha indastering.
Mmaraka oa mantsoe a bohlokoa o tla hola ho tloha ho $ XX milione ka 2021 ho isa ho $ YY milione ka 2030, ka sekhahla sa kholo ea selemo le selemo (CAGR) ea xx%.Asia Pacific e lebelletsoe ho paka kholo e matla ka ho fetisisa, ka CAGR e lebelletsoeng ea ##% ho tloha 2021 ho 2030. Polelo ena ke litaba tse monate bakeng sa libapali tsa 'maraka kaha li na le menyetla e mengata ea ho tsoela pele ka kholo e lebelletsoeng ea indasteri.
Ho ithuta haholoanyane ka kholo ea 'maraka oa metjhini e sehang, ka kopo etela: https://www.datalabforecast.com/industry-report/26282-wafer-cutting-machines-market
Libapali tsa 'maraka li hloaile maqheka a ho qala lihlahisoa tse ngata tse ncha limmarakeng tse ngata lefatšeng ka bophara.Mohlala o hlahelletseng ke mofuta o tla hlahisoa limmarakeng tse robeli tsa EMEA ho Q4 2020 le 2021. Ho ananela mefuta e mengata ea boikoetliso, litlaleho tse ling tsa libapali. bohlokoa ho hlahloba kenyeletsa Applied Materials, Meyer Burger, Komatsu NTC, Takatori, Fujikoshi, HG Laser, Synova, Gocmen, Insreo, Rofin, Hanjiang Machine, Shuanghui Machine, Heyan Technology, Science Instruments Laser.
Le hoja lilemo tsa morao tjena li ka 'na tsa e-ba le tšusumetso e fokolang ha karolo eo e entse phaello e utloahalang, e ka be e bile molemo haeba baetsi ba ne ba nkile khato e entsoeng ke moralo pele ho moo.Ho fapana le nakong e fetileng, empa ka khakanyo e ntle, potoloho ea lichelete tsa US e ntse e tsoela pele. tsoelo-pele, e nang le menyetla e mengata ea kholo ea lik'hamphani ka 2021, e shebahala e le ntle kajeno, empa e lebelletse phaello e matla nakong e tlang.
Hajoale re fana ka litheolelo tsa kotara ho bareki bohle ba rona ba nang le monyetla o phahameng haholo 'me re tšepa hore u tla khona ho nka monyetla ka melemo ena le ho ntlafatsa litlhahlobo tsa hau ho latela litlaleho tsa rona.
Ithute ka litheolelo: https://www.datalabforecast.com/request-discount/26282-wafer-cutting-machines-market
⇛ Menyetla ea bokamoso ea ho etsa lipatlisiso tsa mefuta ea boleng sebakeng sa mochini oa ho qoelisa oa wafer ke efe?
⇛ Ka 2030, mekhatlo e phetseng hantle ke efe?
⇛ Ke menyetla efe ea lipapatso le likotsi tse ka bang teng tse amanang le mechini ea li-wafer dicing ka mokhoa oa tlhahlobo?
Re leboha ho bala sengoloa sena, o ka fumana likarolo tsa likhaolo ka bomong kapa mefuta ea tlaleho ea tikoloho joalo ka Amerika Leboea, Europe Bophirima / Bochabela kapa Asia Boroa-bochabela.
Ka lintlha tse fanoeng tsa 'maraka, Patlisiso ka Limmaraka tsa Lefatše e fana ka lits'ebeletso tse ikhethileng tse ipapisitseng le litlhoko tse ikhethang.


Nako ea poso: Apr-19-2022