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  • Mochini oa ho Seha Laser oa UV

Mochini oa ho Seha Laser oa UV

Tlhaloso e Khutšoanyane:

Mochini oa ho itšeha oa ultraviolet o sebelisoa haholo-holo bakeng sa ho nepahala ha laser micromachining joalo ka ho itšeha ka laser, ho cheka, ho ngola, ho ngola mongolo o foufetseng, joalo-joalo oa libaka tse kobehileng kapa tse bataletseng tse kang liboto tsa PCB, lik'hamera le li-module tsa ho lemoha menoana.


  • Bophara bo bonyenyane ba seam:15 ~ 30um
  • Ho nepahala ha mochini o phahameng:≤± 15um
  • Boleng bo botle ba ho seha:boreleli, sebaka se senyehileng se amehileng ke mocheso, li-burr tse nyane le ho phunyeha ha bohale
  • Ntlafatso ea boholo:bonyane ba boholo ba sehlahisoa ke 20um

    • Lintlha tsa Sehlahisoa

    Mochini oa ho itšeha oa laser oa UV
    Mochini oa ho itšeha oa ultraviolet laser o sebelisoa haholo-holo bakeng sa karohano ea laser ea PCB le ho cheka, kh'amera, mojule oa ho lemoha menoana ea FPC, ho bula fensetere ea filimi ea sekoaelo ea boto e bonolo le e thata, ho sibolla le ho kuta, lakane ea tšepe ea silicon, letlapa la ceramic le scribing, lisebelisoa tse ngata tse tšesaane. le Copper foil, aluminium foil &, carbon fiber, fiber fiber, Pet, PI le tse ling tsa laser cutting processing.E tloaelehileng joalo ka ho seha le ho theha antenna ea koporo, ho seha le ho etsa boto ea PCB, ho seha le ho etsa FPC, ho seha le ho etsa likhalase tsa fiber, ho seha le ho etsa filimi, ho etsa probe e entsoeng ka khauta, joalo-joalo.

    Litekanyetso tsa Tekheniki:

    Lebelo le phahameng la ts'ebetso 500mm/s(X);500mm/s(Y1Y2);50mm/s(Z);
    Ho beha ho nepahala ± 3um (X) ± 3um (Y1Y2); ± 3um (Z);
    1Boemo bo pheta-phetoang bo nepahetse ±1um(X);±1um(Y1Y2);±1um(Z);
    1Lisebelisoa tsa mochini FPC & PCB & PET & PI & foil ea koporo & foil ea aluminium & fiber ea carbon & fiber ea khalase & thepa e kopantsoeng & ceramic le lisebelisoa tse ling
    Botenya ba lerako la thepa 0 ~ 1.0±0.02mm;
    Lethathamo la mechine ea lifofane 400mm * 350mm
    Mofuta oa laser UV fiber laser;
    1Laser wavelength 355±5nm;
    1 Matla a laser Nanosecond & picosecond, 10W & 15W bakeng sa khetho
    1 maqhubu a Laser 10 ~ 300KHz
    1Matla botsitso <± 3% (ts'ebetso e tsoelang pele bakeng sa lihora tsa 12);
    1 Phepelo ea motlakase 220V±10%,50Hz/60Hz;AC 20A(sekhechana se seholo sa potoloho)
    1Mofuta oa faele DXF, DWG & Gebar;
    Litekanyo 1200mm * 1400mm * 1800mm
    Boima ba lisebelisoa 1500Kg.

    Mohlala oa Pontšo:

    setšoantšo10

    Sebaka sa kopo
    PCB laser petsoha & ho phunya;Mojule oa ho tsebahatsa khamera le menoana ea FPC;Ho koahela lifensetere tsa filimi & ho notlolla le ho poma poleiti e thata le e bonolo ea bonding;Letlapa la tšepe la Silicon & Ceramic Scribing;Lisebelisoa tse tšesaane tse entsoeng ka botala & foil ea koporo & foil ea aluminium & fiber ea carbon & fiber ea khalase & Pet & PI laser cutting machining.

    Ho sebetsa ka nepo ka holimo
    Sekhahla se senyenyane sa seam bophara: 15 ~ 35um
    Ho nepahala ha mochini o phahameng ≤ 10um
    Boleng bo botle ba ho seha: ho seha ho boreleli le sebaka se senyenyane se amehileng ke mocheso le li-burr tse nyane
    Tokiso ea boholo: bonyane boholo ba sehlahisoa 50um

    Ho ikamahanya le maemo ho matla
    E na le bokhoni ba ho itšeha ka laser, ho cheka, ho ngola, ho betla sefofu le theknoloji e 'ngoe e ntle ea machining bakeng sa lifofane le lisebelisoa tse tloaelehileng tsa holim'a metsi.
    1 Ka mochini oa FPC & PCB & PET & PI & foil ea koporo & foil ea aluminium & carbon fiber & khalase fiber & thepa e kopantsoeng & ceramic le lisebelisoa tse ling
    E fana ka mofuta o ikhethileng oa XY oa mofuta oa superposition le mofuta o arohaneng o tsitsitseng oa gantry precision motion platform & ho jarolla le ho laolla sistimi bakeng sa khetho.
    Ho fana ka ts'ebetso ea tlhahlobo ea pele ea sebaka sa pono sa CCD sa linaha tse peli le ho ts'oara le sebaka sa sepheo
    E na le lisebelisoa tse nepahetseng tsa vacuum adsorption le sistimi ea lipeipi tsa ho tlosa lerole
    E na le sistimi e iketselitseng ea 2D & 2.5D CAM bakeng sa laser micromachining

    Moqapi o feto-fetohang
    Latela mohopolo oa moralo oa ergonomics, o monate ebile o khuts'oane
    Motsoako oa mesebetsi ea software le ea hardware o fetoha le maemo, o tšehetsa tlhophiso ea ts'ebetso ea motho ka mong le taolo e bohlale ea tlhahiso.
    E ts'ehetsa moralo o motle le oa boqapi ho tloha boemong ba likarolo ho isa boemong ba sistimi
    * Taolo ea mofuta o bulehileng, sistimi ea laser micro-machining software, e bonolo ho e sebetsa le e hlakileng

    Setifikeiti sa tekheniki
    ka CE
    ISO9001
    Setšoantšo sa IATF16949

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