Ho utloisisa indasteri ea kopo ea mochini oa ho itšeha oa laser, a re qaleng ho ithuta hore na o sebetsa joang?Themochini oa ho itšeha oa lasere sebelisa lebone la laser le sa bonahaleng sebakeng sa thipa ea mochini bakeng sa ho seha.Hase feela lebelo la ho itšeha ka potlako le ho nepahala ho phahameng, empa mokhoa oa ho itšeha ha o sa le tlas'a lithibelo leha e le life.boreledi.Karolo ea mochine oa hlooho ea laser cutter ha e na kamano le workpiece, kahoo e ke ke ea etsa hore ho be le likhahla holim'a sebaka sa mosebetsi.Ka lebaka la lebelo la ho itšeha ka potlako le sebaka se senyenyane sa ho kopana, sebaka se amehileng ke mocheso se senyenyane, deformation ea poleiti e nyenyane, 'me ha ho na tokiso e latelang e hlokahalang.Ka lebaka la melemo e ke keng ea lekanngoa ea lithipa tsena tsa mechine, mechine ea ho itšeha ka laser e sebelisoa haholo liindastering tse ngata.
1. Kopo indastering ea lisebelisoa tsa bongaka
Lisebelisoa tsa ho itšeha ka laser tse nepahetseng li sebelisoa haholo liindastering tsa bongaka tse kang lisebelisoa tsa bongaka tse kenang lipakeng, lisebelisoa tsa Endoscopic Bending Section, lisebelisoa tsa ho buoa, lisebelisoa tsa ho buoa tsa masapo.Tse kang heart stent, heart valve stent, low limb stent, intracranial thrombectomy stent, hypotube stent, spiral tube stent, brain fixation stent, urinary cobra bone, biliary cobra bone, gastrointestinal cobra bone, anorectal cobra bone Ho sebetsa ha masapo le tšepe e 'ngoe le tse ling. lisebelisoa tsa bongaka tse seng tsa tšepe.
2. Kopo ho indasteri ea potoloho e kopantsoeng ea semiconductor
Lisebelisoa tsa ho itšeha tsa laser tse nepahetsenge sebelisoa haholo ho seha le ho etsa lisebelisoa tse fapaneng tsa alloy ea tšepe joalo ka lisebelisoa tsa elektroniki tsa 3C, li-semiconductor electroplating carriers, substrates tsa PCB;joalo ka sekoaelo sa mokokotlo oa sekoaelo sa nickel, ho seha sebopeho sa MIM, ho theha lesale la oache, ho seha letlapa la matla, alloy Microstructure forming, ho cheka sapphire, ho seha le ho etsa pampiri ea silicon, ho seha le ho etsa aluminium substrate, ho seha le ho etsa chip, ho seha le ho etsa koporo. le ho theha, likarolo tsa sebopeho ho itšeha le ho etsa, koporo lakane ho itšeha le ho theha, joalo-joalo Laser micromachining ea lisebelisoa tse fapaneng tse bataletseng le tse kobehileng holim'a metsi.
3. Kopo ka ho nepahala 3C le indasteri ea likarolo tsa likoloi
Mochini o nepahetseng oa laser o sebelisoa haholo ho cheka ka ceramic, sebopi sa electroplating, lakane ea tšepe e sa hloekang, lakane ea tšepe ea silicon, letlapa la alloy ea zinki le lisebelisoa tse ling tse sehang le ho etsa, joalo ka letlooeng le kobehileng holim'a aluminium alloy speaker mesh, ho phunya konopo ea keyboard, lakane ea tšepe e sa hloekang kamora PVD, Laser ho itšeha le ho phunya likarolo tse kang lesoba la lehloa le etsang li-square tsa molumo le li-tubes tse chitja, masoba a li-headset, matlooa a lehare, lifahleho tsa likhoune, masoba a mehele, li-notebook shaft micro holes, jj.
Ho na le lits'ebetso tse ngata tsa lisebelisoa tsa ho itšeha ka laser le liindasteri tse tsoetseng pele ho feta.Nakong e tlang, ka ntlafatso e tsoelang pele ea theknoloji ea lisebelisoa tsa laser, e tla sebelisoa ho lokisa likarolo tse nepahetseng haholoanyane.Khamphani ea rona ha e fane feela ka mefuta eohle ea lisebelisoa tse nepahetseng tsa laser, empa hape e fana ka tharollo ea bothata bo le bong bakeng sa ts'ebetso e nepahetseng ea lisebelisoa.Haeba u na le litlhoko tsa ts'ebetso ea lisebelisoa tsa laser, u ka ikopanya le rona!
Nako ea poso: Mar-23-2023