Tharollo e nepahetseng ea 3c

ECLC6045 Precision Laser Cutting Machine bakeng sa Lisebelisoa tsa Hard Brittle

Tlhaloso e Khutšoanyane:

Laser micromachining ea lirafshoa, safire, daemane le tšepe ea calcium, boima bo phahameng le sefofane se phahameng sa brittleness le lisebelisoa tse tloaelehileng tse kobehileng.


Lintlha tsa Sehlahisoa

Tekheniki Parameters

Lebelo le phahameng la ts'ebetso 1000mm/s(X) ;1000mm/s(Yl&Y2) ;50mm/s(Z);
Ho beha ho nepahala ±3um (X) ±3um (Y1&Y2) ±5um (Z);
Ho nepahala ha maemo a pheta-phetoang ± lum (X) ; ± lum(Y1&Y2) ;±3um(Z);
Lisebelisoa tsa mochini Alumina & zirconia & aluminium nitride & silicon nitride & Diamond &
Sapphire & Silicon & gallium arsenide & tungsten tšepe, joalo-joalo;
Botenya ba lerako la thepa 0 ~ 2.0±0.02mm;
Lethathamo la mechine ea lifofane 300mm * 300mm; (tšehetso bakeng sa litlhoko tse kholo tsa sebopeho)
Mofuta oa laser Fiber laser;
Laser wavelength 1030-1070±10nm;
matla a laser CW1000W&QCW150W& QCW300W& QCW450W bakeng sa khetho
Phepelo ea motlakase ea lisebelisoa 220V± 10%, 50Hz;AC 20A (sekhechana se seholo sa potoloho);
Sebopeho sa faele DXF, DWG;
Litekanyo tsa lisebelisoa 1280mm * 1320mm * 1600mm;
Boima ba lisebelisoa 1500Kg.

Mohlala oa Pontšo

ECLC6045-2Sebaka sa kopo

# Laser micromachining ea lirafshoa, safire, daemane le tšepe ea calcium, boima bo phahameng le sefofane se phahameng sa brittleness le lisebelisoa tse tloaelehileng tse kobehileng.

Ho sebetsa ka nepo ka holimo

Sekhahla se senyenyane sa seam bophara: 15 ~ 30um

Ho nepahala ha mochini o phahameng: ≤ ± 10um

Boleng bo botle ba ho cheka: ho cheka ho boreleli, sebaka se senyenyane se amehileng ke mocheso, li-burr tse fokolang le ho phunyeha ka bohale < 15um

Tokiso ea boholo: bonyane boholo ba sehlahisoa ke 100um

Ho ikamahanya le maemo ho matla

1.Ho ba le bokhoni ba ho itšeha ka laser, ho cheka, ho slotting, ho tšoaea le litsebo tse ling tse ntle tsa ho sebetsa bakeng sa lifofane le lisebelisoa tse kobehileng holim'a metsi.

2.Can mochini oa alumina, zirconia, aluminium nitride, silicon nitride, taemane, safire, silicon, gallium arsenide le tungsten tšepe.

3.E na le sethala sa motsamao se ikemetseng se ikemetseng sa double drive, sethala sa granite, aluminium alloy granite beam bakeng sa khetho.

4.Fana ka mosebetsi oa boikhethelo, joalo ka liteishene tse habeli & Visual Positioning & mokhoa oa ho fepa le oa ho theola thepa & tlhahlobo e matla joalo-joalo.

5.E na le bolelele bo bolelele le bo bokhutšoane bo iketselitseng, molomo o bohale le nozzle e bataletseng hlooho e ntle ea laser

6.E na le mokhoa oa ho amohela thepa ea modular le mokhoa oa ho tlosa lerōle

7.Fana ka foreimi e itlhophileng ea tsitsipano le foreimi e tsitsitseng ea tsitsipano & vacuum adsorption & plate ea mahe a linotši, joalo-joalo.

8.E na le sistimi e iketselitseng ea 2D & 2.5D & 3D CAM ea laser micromachining.

Moqapi o feto-fetohang

1.Latela mohopolo oa moralo oa ergonomics, o bobebe ebile o khuts'oane

2.Software e feto-fetohang le tlhophiso ea tšebetso ea hardware, e ts'ehetsang tlhophiso ea ts'ebetso ea motho ka mong le taolo e bohlale ea tlhahiso

3.Tsehetsa moralo o motle oa ntlafatso ho tloha boemong ba karolo ho isa boemong ba sistimi

Taolo ea 4.Open & laser micromachining software e bonolo ho sebetsa & segokanyimmediamentsi sa sebolokigolo

Setifikeiti sa tekheniki

ka CE

ISO9001

Setšoantšo sa IATF16949


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